3D PLUS is the world-leading supplier of advanced high-density 3D microelectronic products, bare die and wafer level stacking technology meeting the demand for high reliability, high performance and very small size of today’s and tomorrow’s electronics. Its patented technology portfolio starts with standard package scale upward to die-size and wafer-level stacking processes, and enables stacking heterogeneous active, passive and Opto-electronics.
3D Plus
Cybersecurity & Storage, Space Qualified